发明名称 充填剤および充填剤のシーリング構造の製造方法
摘要 A liquid epoxy resin, a powdered metal and a hardening agent are provided as a filling material (S) and poured into an insert hole (82). The filling material (S) is in a liquid state under a normal temperature so as to make the filling material (S) handle easily in the filling work. The filling material (S) is hardened at a clearance between a bushing tool (12) and the insert hole (82). The filling material (S) is placed between the bushing tool (12) and the insert hole (82) to enhance a heat-conductivity therebetween. By heat treating a metallic mold die 80, it is possible to char the epoxy resin. This makes it possible to deposit the powdered metal (copper or the like) over an entire area of the clearance so as to highly enhance the heat-conductivity.
申请公布号 JP6019135(B2) 申请公布日期 2016.11.02
申请号 JP20140552099 申请日期 2013.12.13
申请人 渡▲邊▼ 佳代 发明人 渡▲邉▼ 佳代
分类号 B22D17/22;B22C9/06;B29C33/38;C09K3/10 主分类号 B22D17/22
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