COMPONENT-MOUNTING DEVICE

摘要

The present invention is a component-mounting device for mounting, on a circuit substrate, a component having a component mark for alignment on an upper surface. The component-mounting device has: a first suction nozzle for suctioning a component; a transfer head for mounting the component on a circuit substrate; an optical path conversion means arranged above a suction surface, the optical path conversion means converting an optical path of light from the upper surface of the component laterally; a first camera that is capable of receiving light from the changed optical path; a camera moving device for moving the first camera; and a control device for controlling the operations of the transfer head and the camera moving device. The camera moving device moves the first camera in at least a first direction orthogonal to the optical axis of the first camera. An imaging region of the first camera moves in a second direction relative to the center of the component when the first camera moves in the first direction. The control device is provided with a storage unit for storing position information of the component mark beforehand, and the control device suctions the component against the first suction nozzle and causes the camera moving device to move on the basis of the position information in the storage unit.