发明名称 電子機器用カバーガラスのガラス基板及び電子機器用カバーガラス、並びに電子機器用カバーガラスのガラス基板の製造方法
摘要 The present invention provides a glass substrate for a cover glass for an electronic device, in which the strength of an end face having an apex is enhanced. This glass substrate has a pair of end faces adjoining a principal surface, and the end faces are shaped having an apex as viewed in cross-section and have a compressive stress layer due to chemical strengthening, the maximum compressive stress being 600 MPa or greater, and the depth of the compressive stress layer being 60 µm or less. The apex angle theta (degrees) of the apex, the maximum compressive stress (CS) [MPa] of the surface, and the depth (d) [µm] of the compressive stress layer satisfy the relationship 600 MPa <= -3.5 × {(d/sin(theta/2)) - d} + CS.
申请公布号 JP6025156(B2) 申请公布日期 2016.11.16
申请号 JP20140531682 申请日期 2013.08.23
申请人 HOYA株式会社 发明人 高野 徹朗
分类号 C03C21/00;C03C3/083;C03C3/085;C03C3/087 主分类号 C03C21/00
代理机构 代理人
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