ウェーハの洗浄・乾燥装置およびウェーハの洗浄・乾燥方法

摘要

PROBLEM TO BE SOLVED: To provide a wafer cleaning/drying device which allows size reduction of the device and can prevent wafer contamination by particle adhesion.SOLUTION: A wafer cleaning/drying device 10 comprises: a washing tank 12 whose upper part is formed to be a cylindrical part 14 and into which cleaning liquid flows; a rotor 20 formed into a cylinder connected to the washing tank 12, whose lower part side is fitted onto the cylindrical part 14 of the washing tank 12 so as to be arranged rotatably around a center axis of the cylindrical part and whose opening edge on an upper surface side is formed as a mounting part for a wafer 22 to be cleaned and dried; a driving part 26 which rotationally drives the rotor 20; and a bearing formed between the lower part of the rotor 20 and the cylindrical part 14 of the washing tank 12.