ELECTRONIC COMPONENT PRESSURE-BONDING DEVICE AND ELECTRONIC COMPONENT MOUNTING MACHINE

摘要

An electronic component pressure-bonding device (25) in which pressure is applied from above to a die (14) placed on the pressure-bonding part of a circuit board (17) and the die is pressure-bonded to the pressure-bonding part of the circuit board, wherein said device (25) is provided with a plurality of pressurization tools (28) for pressing the die on the pressure-bonding part of the circuit board. Provided is a drive mechanism (27) in which the pressurization tools are supported on support blocks (26) interposed by a conforming mechanism (29) that can be tilted in any direction across 360°, the support blocks being driven vertically. The plurality of support blocks are arranged in the width direction of the circuit board, the circuit board is conveyed by a conveyor (18), the conveying of the circuit board is stopped when the die on the pressure-bonding part of the circuit board has reached below any of the support blocks of the plurality of support blocks, the support blocks are lowered by the drive mechanism for the support blocks, and the die is pressure-bonded to the pressure-bonding part of the circuit board by the pressurization tools of the support blocks.