发明名称 PRINTED WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board capable of performing high-speed signal transmission through a flex wiring section.SOLUTION: A flex wiring section 14F composed of an outermost layer of a resin insulating layer 50F of a first surface side, an outermost layer of a conductor layer 58F, and a conductor layer 58A of a second surface side is formed with a recess 12. Since the conductor layers 58F and 58A are formed on both surfaces of the outermost layer of the resin insulating layer 50F, it is easy to secure the number of wirings and a large amount of signals can be transmitted at high speed.SELECTED DRAWING: Figure 1
申请公布号 JP2016207918(A) 申请公布日期 2016.12.08
申请号 JP20150090180 申请日期 2015.04.27
申请人 IBIDEN CO LTD 发明人 TANIGUCHI HIROTAKA;NAKAMURA TAKENOBU
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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