发明名称 |
VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus and a vapor deposition method that can measure a film thickness with high precision.SOLUTION: There is provided a vapor deposition apparatus comprising: a drain hole 10 arranged at a piping part 2 for guiding a material 8 vaporized at a vapor deposition source 3 in a vacuum chamber 1; a dummy substrate 12 arranged opposite the drain hole 10; a dummy substrate driving device 13 for rotating the dummy substrate 12; a film thickness measuring device 11 arranged at the back of the dummy substrate 12 opposite the drain hole 10 and optical measuring a thin film vapor-deposited on a top surface of the dummy substrate 12; and a dummy substrate heating device 14 heating the dummy substrate 12 and thus vaporizing and eliminating an unnecessary thin film after the film thickness of the vapor-deposited film is measured.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016204707(A) |
申请公布日期 |
2016.12.08 |
申请号 |
JP20150087798 |
申请日期 |
2015.04.22 |
申请人 |
PANASONIC IP MANAGEMENT CORP |
发明人 |
SUETSUGU DAISUKE;OKUMA TAKAFUMI;KOISHIZAKI TSUYOSHI;NAGAI HISAO |
分类号 |
C23C14/24;H01L51/50;H05B33/10 |
主分类号 |
C23C14/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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