| 摘要 |
PROBLEM TO BE SOLVED: To provide a remover composition that suitably peels off a residue (for example, an oxidation product including Al, Cu, and Ti) under low-temperature/short-time peeling-off conditions, is high in corrosion suppression effects against a wiring (particularly, a metal wiring including Al) or the like, and has a small load on an environment; and to provide a semiconductor device manufacturing method using the same. SOLUTION: The remover composition is used in a manufacturing process of a semiconductor device including wiring. The remover composition includes an organic amine, an organic phosphonic acid, a straight-chain sugar alcohol, and water; and has pH of 9-13 at 20°C. COPYRIGHT: (C)2008,JPO&INPIT |
