HEAT DISSIPATING STRUCTURE OF SEMICONDUCTOR LIGHTING LAMP

摘要

A heat dissipating structure of a semiconductor lighting lamp is provided which includes a plurality of heat dissipating fins and ~-type heat conducting pipes. The ~-type heat conducting pipes are provided in a number corresponding to the number of the semiconductor light sources arranged on the circuit board of the lamp. The length of both arms of the heat conducting pipe is larger than or equal to the length with which the plurality of heat dissipating fins are arranged. One arm is welded to the lower side of the circuit board of the lamp, and the other arm protrudes out of the circuit board of the lamp. The plurality of heat dissipating fins are provided with inserting holes corresponding to both opening end terminals of the ~-type heat conducting pipe. Each heat dissipating fin is inserted onto and welded on both opening end terminals of the ~-type heat conducting pipe.