| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method and a mounting device for securely capturing conductive particulate 2 between an electrode 10 and a wiring 5 to be bonded together without changing the content rate of conductive particulate 2, in the mounting method of: coating an electric circuit wiring board 4 with an anisotropic conductive resin 3 prepared by dispersing the conductive particulate 2 electrostatically charged in an organic resin 1 by using a coating device having a coating opening 7; and mounting an electronic component 9 on the coated places. <P>SOLUTION: The coating opening 7 for applying the anisotropic conductive resin 3 has conductivity, and a voltage is applied between the coating opening 7 and the wiring 5 on the electric circuit wiring board 4 to apply the anisotropic conductive resin 3 from the coating opening 7 to the wiring 5 and close to the wiring 5. <P>COPYRIGHT: (C)2009,JPO&INPIT |
