发明名称 ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER
摘要 An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0,90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked.
申请公布号 EP2070127(A2) 申请公布日期 2009.06.17
申请号 EP20070814921 申请日期 2007.09.19
申请人 DOW GLOBAL TECHNOLOGIES INC. 发明人 PATEL, RAJEN, M.;WU, SHAOFU;BERNIUS, MARK, T.;ESSEGHIR, MOHAMED;MCGEE, ROBERT, L.;MAZOR, MICHAEL, H.;NAUMOVITZ, JOHN
分类号 H01L31/048;H01L23/31 主分类号 H01L31/048
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