发明名称 |
ELECTRONIC DEVICE MODULE COMPRISING AN ETHYLENE MULTI-BLOCK COPOLYMER |
摘要 |
An electronic device module comprises: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising an ethylene multi-block copolymer. Typically, the polyolefin material is an ethylene multi-block copolymer with a density of less than about 0,90 grams per cubic centimeter (g/cc). The polymeric material can fully encapsulate the electronic device, or it can be laminated to one face surface of the device. Optionally, the polymeric material can further comprise a scorch inhibitor, and the copolymer can remain uncrosslinked or it can be crosslinked. |
申请公布号 |
EP2070127(A2) |
申请公布日期 |
2009.06.17 |
申请号 |
EP20070814921 |
申请日期 |
2007.09.19 |
申请人 |
DOW GLOBAL TECHNOLOGIES INC. |
发明人 |
PATEL, RAJEN, M.;WU, SHAOFU;BERNIUS, MARK, T.;ESSEGHIR, MOHAMED;MCGEE, ROBERT, L.;MAZOR, MICHAEL, H.;NAUMOVITZ, JOHN |
分类号 |
H01L31/048;H01L23/31 |
主分类号 |
H01L31/048 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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