MEMS MICROPHONE PACKAGE

摘要

An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

主权项

1. A microelectromechanical system (MEMS) microphone package, comprising:
a substrate, comprising:
at least one first hole;an upper surface;a bottom surface;a side surface with two sides connected to the upper surface and the bottom surface, respectively, and the two sides being opposite to each other;at least one first electrically conductive layer disposed on the upper surface; andat least one second electrically conductive layer disposed on the bottom surface; at least one MEMS microphone electrically coupled to the substrate; at least one IC chip electrically coupled to the substrate; and an electrically conductive cover comprising at least one second hole; wherein, the electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip, the at least one first hole and the at least one second hole together form at least one acoustic hole, the at least one acoustic hole has an opening on an outer surface of the MEMS microphone package, the opening has a first boundary and a second boundary, the first boundary of the opening is a part of a boundary of the at least one first hole, and the second boundary of the opening is a part of a boundary of the at least one second hole.