| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulated mounting structure of a semiconductor device, capable of meeting standards of insulation performance without deteriorating heat radiation performance, suppressing the increase of costs and the number of work processes, and achieving a simple and compact structure.SOLUTION: The insulated mounting structure of a semiconductor device comprises: a radiation fin 6 on which a semiconductor device 1 is directly placed; a component 3 made of sheet metal, to which the radiation fin 6 is attached; and an electrically grounded chassis 9 made of sheet metal, to which the component 3 made of metal sheet is attached. A certain spatial distance is secured between the component 3 and the chassis 9, and they are connected to each other through a resin insulating member 10 that is attached to either of the component 3 or the chassis 9 as a solid insulation portion. |
