发明名称 レーザー加工方法
摘要 PROBLEM TO BE SOLVED: To provide a laser processing method capable of stably processing a workpiece even when the processing speed of a laser beam to the workpiece changes.SOLUTION: A laser processing method for processing a workpiece F using a laser beam B includes a step of regulating the pulse oscillation frequency of laser beam B so that the lap rate of laser beam B irradiated to the workpiece F becomes constant when the processing speed of laser beam B to the workpiece F changes, and a step of regulating the output of laser beam B so that the energy amount of laser beam B irradiated to the workpiece F per unit area becomes constant.
申请公布号 JP6020884(B2) 申请公布日期 2016.11.02
申请号 JP20120124424 申请日期 2012.05.31
申请人 住友化学株式会社 发明人 植田 幸治;及川 伸
分类号 B23K26/00;B23K26/38 主分类号 B23K26/00
代理机构 代理人
主权项
地址