| 摘要 |
PROBLEM TO BE SOLVED: To provide an addition curing type silicone composition providing a cured article good in low temperature property and excellent in temperature change resistance and a semiconductor device which includes a semiconductor element encapsulated by the cured article of the composition and has high reliability.SOLUTION: There is provided a silicone composition having (A) branched organopolysiloxane represented by the following formula (1) and having at least two alkenyl groups in a molecule, (B) branched organohydrogenpolysiloxane having at least two hydrosilyl groups in a molecule and (C) a hydrosilylation catalyst.SELECTED DRAWING: None |
