| 发明名称 |
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD |
| 摘要 |
A semiconductor device fabrication method, including preparing a case having a plurality of connection terminals, and fitting a jig onto the case to protect the connection terminals, tips of the connection terminals protruding from the jig. The method further includes fitting a printed circuit board on the tips of the connection terminals protruding from the jig. |
| 申请公布号 |
US2016372392(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201615150641 |
申请日期 |
2016.05.10 |
| 申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
SAKAMOTO Yo |
| 分类号 |
H01L23/055;H01L21/67;H01L21/56;H01L21/52;H01L25/065;H01L23/00;H01L23/498 |
主分类号 |
H01L23/055 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A jig for fabricating a semiconductor device that includes
a case housing a semiconductor element, and connection terminals, formed on the case, that are electrically connected to main electrodes of the semiconductor element,the jig comprising:
a first plate portion and a second plate portion, one of the first and second plate portions having a plurality of holding portions formed therein, and a fixing portion fixing the first and second plate portions, so that the connection terminals are held in and protected by the holding portions, tips of the connection terminals being protrusible from the jig. |
| 地址 |
Kawasaki-shi JP |
