发明名称 |
Light emitting device package and method of fabricating the same |
摘要 |
A light emitting device package and a method of manufacturing the light emitting device package are provided. A base is first provided and a hole is formed on the base. After a light emitting portion is formed on the base, a mold die is placed on the light emitting portion and a molding material is injected through the hole. The mold die is removed to complete the package.
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申请公布号 |
US8178894(B2) |
申请公布日期 |
2012.05.15 |
申请号 |
US20100824824 |
申请日期 |
2010.06.28 |
申请人 |
PARK JUN SEOK;KANG SEOK HOON;LG INNOTEK CO., LTD. |
发明人 |
PARK JUN SEOK;KANG SEOK HOON |
分类号 |
H01L33/00;H01L33/54;H01L33/56;H01L33/62;H01L33/64 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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