| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing liquid which can suppress the occurrence of polishing scratches and can polish a barrier metal which constitutes a barrier layer at a high polishing rate even with a low concentration of polishing particles, and therefore can form a buried pattern of a metal film with a high reliability; to provide polishing equipment which uses the polishing liquid and requires no dressing process for the polishing pad and can stably keep the polishing rate high; and to provide a polishing method for polishing a polished object with a flat surface using the polishing equipment. <P>SOLUTION: The polishing pad consists of nonwoven cloth obtained by dipping polyester fiber into polyurethane containing rigid resin, and then wet-solidifying the polyurethane and making it foam. In the polishing method, the polished object is polished with this polishing pad while supplying to it the polishing liquid which contains an oxidant, protection film forming agent for the metal surface, acid, water, and polishing particles which have an average grain diameter of 70 nm or less and contain primary particles and secondary particles each of which is an aggregate with less than two particles on average. <P>COPYRIGHT: (C)2007,JPO&INPIT |
