| 摘要 |
PROBLEM TO BE SOLVED: To improve the productivity for components used in electronic devices or the like. SOLUTION: The disclosed method for wafer production is characterized by comprising a block body-joining process for joining a plurality of block bodies which comprise crystals processed in a quadratic prism shape in a ranged state while stacking and a cutting process for cutting the outer periphery of a plurality of joined block bodies to form a wafer having a prescribed thickness. The crystal comprises an as-grown artificial quartz crystal, and the block bodies are joined directly or by using a UV-curing adhesive. Cutting is performed at the angle of AT cut. COPYRIGHT: (C)2008,JPO&INPIT
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