METHOD FOR INSPECTING THE BONDING STATE OF RFID CHIP USING DUMMY BUMP AND DUMMY PATTERN

摘要

A method for inspecting junction state between bump and antenna pattern in RFID chip using dummy bump and dummy pattern is provided to improve stability of quality and yield by preventing generation of defect when producing a RFID tag. A method for inspecting junction state between bump and antenna pattern in RFID chip comprises the following steps: a step for forming a dummy bump connected to the other bump through a dummy pattern in a RFID chip(S110); a step for preparing for a film substrate including a pair of probing patterns corresponding to the other bump and the dummy bump(S120); a step for contacting the RFID chip with an antenna pattern on the film substrate in order to connect the other pump and the dummy pump into a pair of probing patterns using an anisotropic conductive adhesive(S130); and a step for measuring a resistance value by contacting the probing pattern with a probe(S140).