发明名称 |
DIE ATTACHMENT METHOD WITH A COVEX SURFACE UNDERFILL |
摘要 |
A method for assembling a microelectronic device is provided comprising the step of adhering a die to a substrate using a convex die attachment process. The convex die attachment process generally comprises a) providing a die having an underfill material thereon, b) picking up and inverting the die, c) heating the underfill until it liquefies at least slightly and forms a convex surface, and d) placing the die on a substrate. |
申请公布号 |
WO2008112883(A3) |
申请公布日期 |
2009.03.19 |
申请号 |
WO2008US56842 |
申请日期 |
2008.03.13 |
申请人 |
LORD CORPORATION;STAPLETON, RUSSELL, A. |
发明人 |
STAPLETON, RUSSELL, A. |
分类号 |
H01L21/56;C09J163/02;H01L21/60;H01L21/98;H01L23/29;H01L25/065 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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