发明名称 PACKAGE
摘要 This package (1) is configured provided with a main body (2) that incorporates an electrical circuit. The main body (2) is configured having a molded section (9) that has been molded from resin, for example. In the main body (2), a through-hole (3) is formed that penetrates from a first surface (2a) to the reverse surface thereof, which is a second surface (2b). Inside the through-hole (3), a connection terminal (4) is provided that electrically connects to the electrical circuit incorporated in the main body (2). The connection terminal (4) is, from the lateral direction of the direction of insertion, able to make contact with an insertion subject (12) inserted into the through-hole (3).
申请公布号 WO2012063321(A1) 申请公布日期 2012.05.18
申请号 WO2010JP69925 申请日期 2010.11.09
申请人 MITSUBISHI ELECTRIC CORPORATION;KUSANO, YOSHIYUKI;SHIMAZAKI, MUTSUMI 发明人 KUSANO, YOSHIYUKI;SHIMAZAKI, MUTSUMI
分类号 H01L23/28 主分类号 H01L23/28
代理机构 代理人
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