发明名称 |
Accessible chip stack and process of manufacturing thereof |
摘要 |
A process of manufacturing a three-dimensional integrated circuit chip or wafer assembly and, more particularly, a processing of chips while arranged on a wafer prior to orienting the chips into stacks. Also disclosed is the manufacture of the three-dimensional integrated circuit wherein the chip density can be very high and processed while the wafers are still intact and generally of planar constructions. |
申请公布号 |
US2007096263(A1) |
申请公布日期 |
2007.05.03 |
申请号 |
US20050266456 |
申请日期 |
2005.11.03 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FURUKAWA TOSHIHARU;HAKEY MARK C.;HOLMES STEVEN J.;HORAK DAVID V.;KOBURGER CHARLES W.III |
分类号 |
H01L29/40;H01L21/44 |
主分类号 |
H01L29/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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