| 摘要 |
A functional device package is provided to reduce a manufacturing cost by enclosing plural MEMS(Micro Electro Mechanical System)-functional elements at the same time on a wafer state. A functional device package includes a functional element(4), a first Si substrate(1), and a second Si substrate(5). The first Si substrate includes a concave portion on an inner surface thereof. A metallize is performed in the concave portion. A metallize is performed on a position of the second Si substrate, which corresponds to the concave portion of the first Si substrate. The metallize formed on an inner surface of the concave portion of the first Si substrate is adjoined with the metallize formed on the second Si substrate by melting a solder. The first and second Si substrates are bonded to each other, such that the functional element is enclosed in the functional device package. |
