METHOD OF FORMING SILICATE POLISHING PAD

摘要

PROBLEM TO BE SOLVED: To provide a polishing pad in which a planarization removal rate and scratches are improved and variations between pads are further reduced.

SOLUTION: A method includes steps for: introducing a feed stream of gas-filled polymeric microelements into a gas jet; passing the gas-filled microelements in the gas jet adjacent a Coanda block; and separating coarse polymeric microelements from the curved wall of the Coanda block to collect polymeric microelements. The collected polymeric microelements contain less than 0.1 weight percent of the total of the related polymeric microelements: silicate particles having particle sizes of larger than 5 μm; silicate-containing regions covering larger than 50 percent of the outer surface of the polymeric microelements; and polymeric microelements agglomerated with silicate particles to an average cluster size of larger than 120 μm. By inserting cleaned polymeric microelements into a polymeric matrix, the polishing pad is formed.

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