| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a segregating apparatus for solving a warping problem by segregating semiconductor elements one by one in a semiconductor inspection device. <P>SOLUTION: The segregating apparatus includes a power source, a press-down table, a first swing arm set, a second swing arm set, a third swing arm set, a first gripper set, a second gripper set, a first push block, a second push block and a stop arm. Segregating operation is conducted with the first gripper set, the second gripper set and the stop arm by driving the power source, lowering the press-down table and pressing the respective swing arm sets. This segregating apparatus has only a power source and segregates by moving respective members by this power source, so that it is possible to reduce the volume of a feed system by accelerating a segregating speed. <P>COPYRIGHT: (C)2010,JPO&INPIT |
