发明名称 METHOD FOR BREAKING BRITTLE MATERIAL SUBSTRATE
摘要 PURPOSE: A method for breaking a brittle material substrate is provided to secure dimension precision of divided pieces through proper division with reduced dimension differences without presenting conditions for setting intervals of upper blades. CONSTITUTION: A method for breaking a brittle material substrate is as follows. Second break bars(3,4) are arranged in two positions located at a set interval, 1.3-1.6 times a division pitch, from a predetermined division position. A brittle material substrate(5) is pressed and broken by contacting the second break bars to the brittle material substrate.
申请公布号 KR20120059355(A) 申请公布日期 2012.06.08
申请号 KR20110112115 申请日期 2011.10.31
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. 发明人 MURAKAMI KENJI;TAKEDA MASAKAZU
分类号 B28D5/00;B28B11/14;H01L21/301 主分类号 B28D5/00
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