| 摘要 |
The objective of the present invention is to provide an electronic component in which a cover member is resistant to deformation during formation of a molded resin layer, and which has good heat dissipation characteristics. Electrodes constituting functional units are provided on a piezoelectric substrate 2. In order to form a hollow portion into which the functional units face there are provided a frame-shaped first supporting member 11, and second supporting members 12 to 14 on the piezoelectric substrate 2 in an inside region surrounded by the first supporting member 11. A cover member 17 is stacked on the first and second supporting members 11 and 12 to 14, thereby forming the hollow portion. The heights of the second supporting members 12 to 14 are greater than the height of the first supporting member 11. |
