ELECTRONIC DEVICE

摘要

In the present invention, a leaf spring (51) is disposed between a circuit substrate (20) and an upper shield (30). The leaf spring (51) impels a heatsink (14) toward the circuit substrate (20) via a connection member (52). The leaf spring (51) is not electrically connected to the upper shield (30). Due to this configuration, it is possible to reliably bring an integrated circuit and a heatsink into contact with each other. In addition, the occurrence of unnecessary radiation can be effectively suppressed.