发明名称 MOLD AND RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a resin molding such as a resin sheet having high liquid repellency on its surface.SOLUTION: A mold 20 is used for forming a resin molding comprising liquid repellency by structure transfer from a transfer surface. The transfer surface comprises plural micro recessed structures 21 formed of recessed parts whose maximum opening diameter is equal to or more than 15 μm and equal to or less than 100 μm. In addition, the transfer surface comprising the surfaces of the micro recessed structures 21 comprises plural nano recessed structures 22 formed of recessed parts whose maximum opening diameter is equal to or more than 50 nm and equal to or less than 1000 nm.SELECTED DRAWING: Figure 4
申请公布号 JP2016203490(A) 申请公布日期 2016.12.08
申请号 JP20150087803 申请日期 2015.04.22
申请人 TOPPAN PRINTING CO LTD;TOKYO METROPOLITAN UNIV 发明人 YAMAGUCHI YUKIYASU;MASUDA HIDEKI;YAGISHITA TAKASHI
分类号 B29C33/42;B29C33/38;B29C59/04 主分类号 B29C33/42
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