| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting device in which warping of an HB substrate and an IC chip is reduced in surface IC packaging of an ink jet recording head. SOLUTION: The device for connecting a substrate and an IC chip through adhesive comprises a pressure applying member, and a curing oven for heating the atmosphere wherein the pressure applying member comprises a support for backing up the substrate, a section for generating compression pressure, a pressure receiving member for applying the pressure from the compression pressure generating section to the IC chip, and a film arranged between the pressure receiving member and the rear surface of the IC chip in order to protect the pressure receiving member. COPYRIGHT: (C)2006,JPO&NCIPI
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