| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To stably connect electrodes installed in different semiconductor chips. <P>SOLUTION: A structure 100 includes: a first substrate 101 having a first solder resist 195 on the surface; a second substrate 111 having a second solder resist 197 on the surface; and an adhesive tape 181 installed so as to be brought into contact with the substrate surfaces. The first substrate 101 and the second substrate 111 are respectively formed with a first concave 192 and a second concave 194, and the bottom sections of the first concave 192 and the second concave 194 are respectively configured of a first electrode 191 and a second electrode 193. A plurality of conductive particles 183 in the adhesive tape 181 are provided with first conductive particle 183a brought into contact with the first electrode 191 and the second electrode 193, and second conductive particles 183b having almost the same particle diameters as those of the first conductive particle 183a caved into the first solder resist 195 and the second solder resist 197. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
