| 摘要 |
The present invention relates to a method for assembling two substrates (1,2) by means of molecular adhesion, wherein the method comprises the following: a first step (a) for bringing first and second substrates (1,2) in contact to form an assembly (3) having an assembly interface (4); and a second step (b) for enhancing the degree of adhesion in the assembly (3) to a critical adhesion value or above, where water no longer expands along the assembly interface. The method further comprises: an anhydrous treatment step (c) for the first and second substrates (1,2) under a treatment atmosphere having a dew point of -10 °C or below; and a step for controlling the dew point of the treatment atmosphere under which the first and second substrates (1,2) are exposed, from the anhydrous treatment step (c) to the end of the second step (b), in order to prevent the occurrence of defects at the assembly interface. |
