BONDING METHOD, COMPUTER STORAGE MEDIUM, BONDING APPARATUS, AND BONDING SYSTEM

摘要

The present invention is to properly test and adjust a location of a horizontal direction between bonded substrates, thereby properly performing a bonding process therebetween. An upper wafer is hold and supported on a lower surface of an upper chuck (step S5). A temperature adjustment unit adjusts the temperature of a lower wafer higher than the temperature of the upper wafer (step S9). The lower wafer is hold and supported on an upper surface of a lower chuck (step S10). A state of the lower wafer is inspected by capturing images of multiple reference points of the lower wafer hold and supported on the lower chuck via an imaging unit, and by measuring a location of the multiple reference points, thereby comparing a measured result with a certain allowable range (step S12). A center unit of the upper wafer is pressurized by a pressurization member (step S16), and the upper wafer and the lower wafer are bonded in order, from the center unit of the upper wafer toward an outer circumference unit thereof in a state that the center unit of the upper wafer comes into contact with a center unit of a second substrate (step S17).