发明名称 |
PATTERN FORMING METHOD, METHOD FOR FORMING PATTERNED MASK, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE |
摘要 |
There is provided a pattern forming method which includes (I) a step of forming a first film by applying an active light-sensitive or radiation-sensitive resin composition which contains (A) a resin having a repeating unit having a group that is decomposed by the action of an acid and generates a polar group and (B) a compound that generates an acid by irradiation with active light or radiation to a substrate, (II) a step of exposing the first film, (III) a step of forming a line-and-space pattern by developing the exposed first film, and (IV) a step of coating the line-and-space pattern with a second film, in which the top width of the line pattern of the line-and-space pattern formed in Step (III) is larger than the bottom width thereof. |
申请公布号 |
US2016209749(A1) |
申请公布日期 |
2016.07.21 |
申请号 |
US201615083389 |
申请日期 |
2016.03.29 |
申请人 |
FUJIFILM Corporation |
发明人 |
YAMAMOTO Hisao;SUGIYAMA Shinichi |
分类号 |
G03F7/40;G03F7/20;G03F7/32;G03F7/16 |
主分类号 |
G03F7/40 |
代理机构 |
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代理人 |
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主权项 |
1. A pattern forming method comprising:
Step (I) of forming a first film by applying an active light-sensitive or radiation-sensitive resin composition which contains (A) a resin having a repeating unit having a group that is decomposed by the action of an acid and generates a polar group and (B) a compound that generates an acid by irradiation with active light or radiation to a substrate; Step (II) of exposing the first film; Step (III) of forming a line-and-space pattern by developing the exposed first film; and Step (IV) of coating the line-and-space pattern with a second film, wherein the top width of a line pattern of the line-and-space pattern formed in Step (III) is larger than the bottom width thereof. |
地址 |
Tokyo JP |