PRINTED WIRING BOARD CAPABLE OF SUPPRESSING MOUNTING FAILURE OF SURFACE MOUNT DEVICE FOR FLOW SOLDERING

摘要

The width of a lead-terminal connection pad on a printed wiring board is not greater than the width of a lead terminal. Therefore, a wider space can be secured between adjacent solder joints, so that bridge failure can be suppressed. Further, the length of projection of the lead-terminal connection pad at the proximal portion of the lead terminal is shorter than that of a lead-terminal connection pad on a conventional printed wiring board. Thus, a solder pool at the proximal portion of the lead terminal can be reduced to suppress bridge defect.

主权项

1. A printed wiring board on which a surface mount device with a plurality of lead terminals is mounted by flow soldering, the printed wiring board comprising:
a plurality of lead-terminal connection pads for mounting the surface mount device, wherein the distance between each two adjacent ones of the lead terminals is not greater than the distance between each two adjacent ones of the lead-terminal connection pads.