| 发明名称 |
LIGHT EMITTING DEVICE PACKAGE |
| 摘要 |
A light emitting device package is provided. The light emitting device package may include a package body, a circuit pattern on the package body, a light emitting chip on the circuit pattern, a connector to connect the light emitting chip to the circuit pattern, a phosphor layer on the light emitting chip, and a first protective layer including a Group III nitride provided on the package body to cover the circuit pattern, the light emitting chip, and the connecting member. |
| 申请公布号 |
US2016240745(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201615019210 |
申请日期 |
2016.02.09 |
| 申请人 |
LG INNOTEK CO., LTD. |
发明人 |
KIM WON JIN;PARK JIN GYEONG;LEE IN JAE |
| 分类号 |
H01L33/50;H01L33/46;H01L33/62 |
主分类号 |
H01L33/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A light emitting device package, comprising:
a package body; a circuit pattern on the package body; a light emitting chip on the circuit pattern; a connector to connect the light emitting chip to the circuit pattern; a phosphor layer on the light emitting chip; and a first protective layer provided on the package body to cover the circuit pattern, the light emitting chip, and the connector, the first protective layer including a Group III nitride. |
| 地址 |
SEOUL KR |
