| 发明名称 |
ANTENNA ON CERAMICS FOR A PACKAGED DIE |
| 摘要 |
An antenna is described on ceramics that may be used for a packaged die. In one example, a package has a die, a ceramic substrate over the die, an antenna attached to the ceramic substrate, and conductive leads electrically connecting the antenna to the die. |
| 申请公布号 |
US2016240492(A1) |
申请公布日期 |
2016.08.18 |
| 申请号 |
US201314361625 |
申请日期 |
2013.12.09 |
| 申请人 |
INTEL CORPORATION |
发明人 |
Wolter Andreas;Maruthamuthu Saravana;Knudsen Mikael;Thorsten Meyer;Seidemann Georg;Herrero Pablo;Jaervinen Pauli |
| 分类号 |
H01L23/66;H01Q1/50;H01Q1/52;H01L23/498;H01L21/48;H01L23/31;H01L23/552;H01L25/065;H01L23/00;H01Q1/38;H01L23/48 |
主分类号 |
H01L23/66 |
| 代理机构 |
|
代理人 |
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| 主权项 |
|
| 地址 |
Santa Clara CA US |
