发明名称 PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a plating method capable of obtaining a plated produce satisfactory in appearance shape.SOLUTION: Provided is a plating method comprising: an electroless plating step where a conductive film 11a is formed on a non-conductive base material 11; and an electroplating step where a metal film is formed on the conductive film 11a using an auxiliary electrode 12 arranged in accordance with the shape of the non-conductive base material 11. In the electroless plating step, in a state where the auxiliary electrode 12 is positioned in the non-conductive base material 11, the non-conductive base material 11 is immersed into an electroless plating liquid 21 together with the auxiliary electrode 12 to form the non-conductive film 11a. In the electroplating step, in a state where the auxiliary electrode 12 is positioned in the non-conductive base material 11, the non-conductive base material 11 is immersed into the electroplating liquid together with the auxiliary electrode 12 to form the metal film, and in the electroless plating step, energization is performed with the auxiliary electrode 12 as an anode and the conductive member 22 immersed into the electroless plating liquid 21 as a cathode.SELECTED DRAWING: Figure 1
申请公布号 JP2016164294(A) 申请公布日期 2016.09.08
申请号 JP20150044836 申请日期 2015.03.06
申请人 TOYODA GOSEI CO LTD 发明人 HIEI TAKAO;KAWAHARA ATSUSHI
分类号 C25D21/00;C23C18/31;C25D5/56;C25D17/10 主分类号 C25D21/00
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