| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer manufacturing method and a wafer, which enable singulation of oscillation elements from a wafer.SOLUTION: A wafer manufacturing method of the present embodiment includes: a first etching step of etching a crystal substrate 10 as a wafer to form a first region 20 which is a region corresponding to a thin part and simultaneously half-etching a region corresponding to an outer shape of an oscillation element 12 by a depth of the thin part; and a second etching step of etching the half-etched regions corresponding to the outer shapes to form outer shapes of individual oscillation elements 12.SELECTED DRAWING: Figure 7 |
