发明名称 ADJUSTMENT METHOD OF POLISHING PAD
摘要 PROBLEM TO BE SOLVED: To provide an adjustment method of a polishing pad for adjusting the polishing pad so that a workpiece can be polished in a uniform thickness.SOLUTION: An adjustment method of a polishing pad (44) comprises an initialization step of processing an action surface (44a) of the polishing pad in a predetermined shape, a polishing step of polishing a workpiece by making the action surface of the polishing pad act on an action object surface (11b) of the workpiece (11), a measurement step of measuring irregularity of the workpiece polished in the polishing step along the radial direction and an adjustment step of adjusting a shape of the action surface of the polishing pad so that the workpiece can be polished in a uniform thickness, and in the adjustment step, the action surface is adjusted in a shape of projecting an area (A3) of the action surface corresponding to a convex area (A1) of the workpiece from an area (A4) of the action surface corresponding to a concave area (A2) of the workpiece.SELECTED DRAWING: Figure 7
申请公布号 JP2016179513(A) 申请公布日期 2016.10.13
申请号 JP20150059944 申请日期 2015.03.23
申请人 DISCO ABRASIVE SYST LTD 发明人 WATANABE SHINYA;ASAI KOHEI
分类号 B24B37/00;B24B53/00;B24B53/12;H01L21/304 主分类号 B24B37/00
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