发明名称 配線基板
摘要 An wiring board of the present invention includes an insulating board, a pair of signal external connection pads, a pair of ground external connection pads, a pair of signal through-hole conductors, a pair of around through-hole conductors, a core ground conductor layer having an opening, a via-hole conductor, a strip-shaped wiring conductor, an upper-side signal connection conductor, and a lower-side signal connection conductor, in which the pair of the ground through-hole conductors is arranged across the opening from each other.
申请公布号 JP6034279(B2) 申请公布日期 2016.11.30
申请号 JP20130247003 申请日期 2013.11.29
申请人 京セラ株式会社 发明人 中川 芳洋
分类号 H05K1/02;H01L23/12;H05K3/46 主分类号 H05K1/02
代理机构 代理人
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