| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning device and a cleaning method of a wafer which achieves a uniform etching amount.SOLUTION: A cleaning device of a wafer includes: a tank where a wafer is disposed; a cleaning liquid injection device having a nozzle injecting a cleaning liquid to the wafer disposed in the tank; a cleaning liquid supply device supplying the cleaning liquid so as to accumulate the cleaning liquid in the tank; a discharge device discharging the cleaning liquid in the tank from a bottom part of the tank to the exterior; and a control device controlling the cleaning liquid injection device, the cleaning liquid supply device, and the discharge device so as to perform a first cleaning process where the cleaning liquid is injected to the wafer disposed in the tank thereby removing a chemical solution adhering to a surface of the wafer and a second cleaning process where the wafer is immersed in the cleaning liquid after the first cleaning process and then the cleaning liquid is discharged from the tank thereby removing the chemical solution adhering to the surface of the wafer. |
