| 摘要 |
PROBLEM TO BE SOLVED: To improve a heat dissipation property of a substrate on which an electronic component is mounted, in relatively simple structure and at a low cost.SOLUTION: A heat dissipation substrate comprises one or more inter-layer heat transfer layers 330 in an inner layer of a multilayer substrate on which an electronic component EC is mounted. Heat that is generated from the electronic component is dissipated through the inter-layer heat transfer layers to the outside by the heat dissipation substrate while being made uniform on the heat dissipation substrate. In the heat dissipation substrate, an extension part 335 is provided at an edge of the inter-layer heat transfer layer, and an opening is provided from a substrate surface to the inter-layer heat transfer layer. A heat dissipation case 400 is configured to house the heat dissipation substrate therein while connecting the heat dissipation substrate with the extension part and connecting it to the inter-layer heat transfer layer within the opening by a heat transfer projection.SELECTED DRAWING: Figure 4 |
