| 摘要 |
PROBLEM TO BE SOLVED: To provide a method capable of manufacturing a semiconductor chip with a high productivity.SOLUTION: The manufacturing method of semiconductor chip, includes the steps of: forming plural mask layers 20 which are separated from each other on a semiconductor substrate; defining plural first parts 11 which are covered with plural mask layers in the semiconductor substrate and a second part 12 which is an expose area in the semiconductor substrate; forming a discontinuous layer of a catalyst 31 over the second part; partially etching the second part under conditions containing catalyst; and thereby reducing the mechanical strength of the second part. Subsequently, the semiconductor substrate is cut off at a position of the second part in a mechanical manner.SELECTED DRAWING: Figure 6 |
