Contact arrangement for multi-component smart cards has contact unit with metallised bearer with external contacting ISO contacts formed by suitable structuring of metallised coating

摘要

The arrangement consists of a contact unit (1) formed of a carrier (6) having metallised layer (7). Contact windows (10) are formed in carrier (6) on side of unit (1) facing towards card body. Inside the contact window, bumps (2) are on rear sides of the ISO contacts (5). Diffusion block layer (8) is formed between rear side contact surface of ISO contacts and bumps. Bump height is between 50 micrometer and maximum height of card.