| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming a resist pattern by which the resist pattern can be formed with less man-hour without lowering the manufacturing yield of a conductor pattern nor prolonging the manufacturing time of the conductor pattern, at the time of manufacturing a resist pattern, conductor pattern, and printed wiring board by using a direct resist plotting method, in the method of manufacturing the conductor pattern and the printed wiring board. SOLUTION: (1) In the formation of the resist pattern by using the direct resist plotting method, the resist pattern is formed by irradiating photosensitive resist ink with ultraviolet rays or visible light rays simultaneously with or immediately after the ink adheres to a substrate. (2) In the formation of the resist pattern by using the direct resist writing method, the resist pattern is formed by irradiating photosensitive resist ink with ultraviolet rays or visible light rays immediately after the ink is separated from a photosensitive resist ink discharge opening. (3) The conductor pattern is formed by using the method described in (1) or (2). (4) In addition, the printed wiring board is manufactured by using the method described in (3). COPYRIGHT: (C)2005,JPO&NCIPI
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