| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a mounting substrate which can restrain a manufacturing cost, enables application to a both-sided substrate and has high handling property, a mounting method of an electronic component, an inspection method of a mounted substrate, or the like. SOLUTION: An aggregate substrate 10 which is formed by integrating a plurality of mounting substrates 11 planar via a cutting margin 12 is formed, and meanwhile, a reinforcement substrate 20 is formed which is thicker than the aggregate substrate 10 and has a through opening part 21 formed to leave a supporting part 22 whose width is larger than that of the cutting margin 12 at least in a part corresponding to the cutting margin 12. Thereafter, the aggregate substrate 10 and the reinforcement substrate 20 are laminated so that the cutting margin 12 of the aggregate substrate 10 and the supporting part 22 of the reinforcement substrate 20 overlap each other, the aggregate substrate 10 is cut along the cutting margin 12 and divided into the separate mounting substrate 11. Furthermore, an electronic component is mounted on a mounting substrate with the mounting substrate fixed to the reinforcement substrate, and the mounted electronic component is inspected. COPYRIGHT: (C)2005,JPO&NCIPI
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