| 摘要 |
PROBLEM TO BE SOLVED: To provide a high heat radiating plastic package and the manufacturing method thereof, employing no adhesive for connecting a substrate for forming a conductive pattern and a heat radiator plate, inexpensive, excellent in connecting accuracy, miniaturized and thin. SOLUTION: The high heat radiating plastic package is constituted of a resin film with a Cu foil 13 formed by connecting a bonding resin 12 to a first Cu foil 11 to form an upper surface conductor wiring pattern 20, and provided with a notched part 17 for a cavity unit 16 for mounting a semiconductor element at the substantially central part of the same in a plan view; and a connecting body 15 formed by directly connecting a second Cu foil 14, substantially the same as or thicker than the first Cu foil 11 for radiating the heat generated from the semiconductor element, and forming the lower surface conductor wiring pattern 20a. Further, the package is provided with the conductor patterns 20, 20a on the upper and lower surfaces of the connecting body, on which a via 19 for electrically conducting the upper and lower surfaces is provided. COPYRIGHT: (C)2005,JPO&NCIPI
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