发明名称 SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor memory device which can reliably read data therefrom. SOLUTION: An OUM 100 as the semiconductor memory device comprises a semiconductor substrate 1 and a laminate 10 formed on the semiconductor substrate 1. The laminate 10 includes a memory layer 6 having a first state (amorphous state) exhibiting a first electric resistance and a second state (crystalline state) having a second electric resistance smaller than the first electric resistance, and also including a heating layer 5 having nearly the same width as the memory layer 6 for heating the memory layer 6. The OUM 100 comprises bit lines 9 electrically connected to the memory layer 6 and extended in a predetermined direction. The heating layer 5 has nearly the same width W1 as the memory layer 6 along the extension direction of the bit lines 9. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005051122(A) 申请公布日期 2005.02.24
申请号 JP20030282966 申请日期 2003.07.30
申请人 RENESAS TECHNOLOGY CORP 发明人 OISHI TSUKASA
分类号 H01L27/10;H01L27/105;H01L45/00;(IPC1-7):H01L27/10 主分类号 H01L27/10
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